Products
Chip Test Socket
| Product Introduction | With design templates, drawings of sockets and covers designed for a specific chip can be quickly completed. For different chips, the standard socket will give the product the same dimensional characteristics and a uniform overall appearance. |
| Product Characteristics | Standard material, provide the best test performance, suitable for WLCSP, BGA, QFN, QFP variety of packages, 0.3~1.0mm pin spacing, optimized positioning frame design, excellent contact resistance and current tolerance, three-temperature test capability (-40°C-150°C) |
| Package Type | QFN |
| Mechanical Property | Product pin spacing: 0.3~1.0mm, probe elasticity: 30±5g, test travel 0.45mm |
| Reliability | Probe service life: >50K, test socket service life: >100K, cleaning frequency: 5K |
| Materials Used | Material: Aluminum alloy, ceramic PEEK, other engineering plastics specified by customers, spring probe head material: alloy, gold, spring material: spring steel |
| Electrical Property | Contact resistance: 50mQ, current carrying capacity: ≤2A continuous current, bandwidth: >20GHZ@-1db |
- Parameters
| Product Introduction | With design templates, drawings of sockets and covers designed for a specific chip can be quickly completed. For different chips, the standard socket will give the product the same dimensional characteristics and a uniform overall appearance. |
| Product Characteristics | Standard material, provide the best test performance, suitable for WLCSP, BGA, QFN, QFP variety of packages, 0.3~1.0mm pin spacing, optimized positioning frame design, excellent contact resistance and current tolerance, three-temperature test capability (-40°C-150°C) |
| Package Type | QFN |
| Mechanical Property | Product pin spacing: 0.3~1.0mm, probe elasticity: 30±5g, test travel 0.45mm |
| Reliability | Probe service life: >50K, test socket service life: >100K, cleaning frequency: 5K |
| Materials Used | Material: Aluminum alloy, ceramic PEEK, other engineering plastics specified by customers, spring probe head material: alloy, gold, spring material: spring steel |
| Electrical Property | Contact resistance: 50mQ, current carrying capacity: ≤2A continuous current, bandwidth: >20GHZ@-1db |
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