Products
Product Introduction | Socket drawings for specific chip designs can be quickly completed with specific design templates. For different chips, the standard socket will give the product the same dimensional characteristics and a uniform overall appearance. |
Product Characteristics | Standard material, provide the best test performance, suitable for WLCSP, BGA, QFN,QFP variety of packages, 0.3~1.0mm pin spacing, optimized positioning frame design, excellent contact resistance and current tolerance, three-temperature test capability (-40°C-150°C) |
Package Type | BGA |
Mechanical Property | Product pin spacing: 0.3~1.0mm, probe elasticity: 30±5g, test travel 0.45mm |
Reliability | Probe service life: >50K, test socket service life: >100K, cleaning frequency: 5K |
Materials used | Material: Aluminum alloy, ceramic PEEK, other engineering plastics specified by customers, spring probe head material: alloy, gold, spring material: spring steel |
Electrical Property | Contact resistance: 50mQ, current carrying capacity: ≤2A continuous current, bandwidth: >20GHZ@-1db |
Product Introduction | Socket drawings for specific chip designs can be quickly completed with specific design templates. For different chips, the standard socket will give the product the same dimensional characteristics and a uniform overall appearance. |
Product Characteristics | Standard material, provide the best test performance, suitable for WLCSP, BGA, QFN,QFP variety of packages, 0.3~1.0mm pin spacing, optimized positioning frame design, excellent contact resistance and current tolerance, three-temperature test capability (-40°C-150°C) |
Package Type | BGA |
Mechanical Property | Product pin spacing: 0.3~1.0mm, probe elasticity: 30±5g, test travel 0.45mm |
Reliability | Probe service life: >50K, test socket service life: >100K, cleaning frequency: 5K |
Materials used | Material: Aluminum alloy, ceramic PEEK, other engineering plastics specified by customers, spring probe head material: alloy, gold, spring material: spring steel |
Electrical Property | Contact resistance: 50mQ, current carrying capacity: ≤2A continuous current, bandwidth: >20GHZ@-1db |